Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC). Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues.
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Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC). Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues.
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Add this copy of 3d Integration for Vlsi Systems to cart. $69.32, very good condition, Sold by Hamelyn rated 4.0 out of 5 stars, ships from Coslada, SP, SPAIN, published 2011 by Jenny Stanford Publishing.
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New. Sewn binding. Cloth over boards. 378 p. Contains: Unspecified, Illustrations, black & white, Illustrations, color. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
Add this copy of 3D Integration for VLSI Systems to cart. $130.19, like new condition, Sold by GreatBookPricesUK5 rated 5.0 out of 5 stars, ships from Castle Donington, DERBYSHIRE, UNITED KINGDOM, published 2011 by Jenny Stanford Publishing.
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Fine. Sewn binding. Cloth over boards. 378 p. Contains: Unspecified, Illustrations, black & white, Illustrations, color. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
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New. Sewn binding. Cloth over boards. 378 p. Contains: Unspecified, Illustrations, black & white, Illustrations, color. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
Add this copy of 3D Integration for VLSI Systems to cart. $140.98, like new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2011 by Jenny Stanford Publishing.
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Seller's Description:
Fine. Sewn binding. Cloth over boards. 378 p. Contains: Unspecified, Illustrations, black & white, Illustrations, color. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
