3D Microelectronic Packaging: From Fundamentals to Applications

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This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal ...

3D Microelectronic Packaging: From Fundamentals to Applications 2017, Springer

ISBN-13: 9783319445847

2017 edition

Hardcover

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