This book offers a current state of the art in analysis and modeling of creep phenomena with applications to the structural mechanics. It presents the some presentations from the IUTAM-Symposium series "Creep in Structures", which held in Magdeburg (Germany) in September 2023, and it discusses many advances and new results in the field. These are for example: interlinks of mechanics with materials science in multi-scale analysis of deformation and damage mechanisms over a wide range of stresses and temperature; development ... Read More
This book offers a current state of the art in analysis and modeling of creep phenomena with applications to the structural mechanics. It presents the some presentations from the IUTAM-Symposium series "Creep in Structures", which held in Magdeburg (Germany) in September 2023, and it discusses many advances and new results in the field. These are for example: interlinks of mechanics with materials science in multi-scale analysis of deformation and damage mechanisms over a wide range of stresses and temperature; development and analysis of new alloys for (ultra)high-temperature applications; formulation and calibration of advanced constitutive models of inelastic behavior under transient loading and temperature conditions; development of efficient procedures and machine learning techniques for identification of material parameters in advanced constitutive laws; introduction of gradient-enhanced and non-local theories to account for damage and fracture processes; and applicationof new experimental methods, such as digital image correlation, for the analysis of inelastic deformation under multi-axial stress state. Read Less
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Add this copy of Creep in Structures VI to cart. $142.80, new condition, Sold by Educational Media Centre rated 4.0 out of 5 stars, ships from New Delhi, DELHI, INDIA, published 2024 by Springer International Publishing AG.
Add this copy of Creep in Structures VI to cart. $144.04, new condition, Sold by Educational Media Centre rated 4.0 out of 5 stars, ships from New Delhi, DELHI, INDIA, published 2023 by Springer International Publishing AG.
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