This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD). The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.
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This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD). The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.
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Add this copy of Electronic Materials Innovations and Reliability in to cart. $140.88, new condition, Sold by Basi6 International rated 5.0 out of 5 stars, ships from Irving, TX, UNITED STATES, published 2025 by Springer International Publishing AG.
Add this copy of Electronic Materials Innovations and Reliability in to cart. $178.08, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2025 by Springer International Publishing AG.
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New. Contains: Illustrations, black & white, Illustrations, color. Springer Series in Reliability Engineering . XV, 178 p. 76 illus., 69 illus. in color. Intended for professional and scholarly audience.
Add this copy of Electronic Materials Innovations and Reliability in to cart. $122.95, new condition, Sold by Educational Media Centre rated 4.0 out of 5 stars, ships from New Delhi, DELHI, INDIA, published 2025 by Springer International Publishing AG.
