Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex).
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Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex).
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Add this copy of Foldable Flex and Thinned Silicon Multichip Packag to cart. $120.49, new condition, Sold by Educational Media Centre rated 4.0 out of 5 stars, ships from New Delhi, DELHI, INDIA, published 2014 by Springer-Verlag New York Inc..
Add this copy of Foldable Flex and Thinned Silicon Multichip Packag to cart. $136.15, new condition, Sold by Basi6 International rated 5.0 out of 5 stars, ships from Irving, TX, UNITED STATES, published 2014 by Springer-Verlag New York Inc..
Add this copy of Foldable Flex and Thinned Silicon Multichip Packaging to cart. $168.69, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2014 by Springer-Verlag New York Inc..
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Seller's Description:
New. Print on demand Contains: Illustrations, black & white. Emerging Technology in Advanced Packaging . XIX, 347 p. 266 illus. Intended for professional and scholarly audience.
Add this copy of Foldable Flex and Thinned Silicon Multichip Packaging to cart. $190.96, new condition, Sold by Ria Christie Books rated 5.0 out of 5 stars, ships from Uxbridge, MIDDLESEX, UNITED KINGDOM, published 2014 by Springer-Verlag New York Inc..
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Seller's Description:
New. Contains: Illustrations, black & white. Emerging Technology in Advanced Packaging . XIX, 347 p. 266 illus. Intended for professional and scholarly audience.
