This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously.
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This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously.
Read Less
Add this copy of Interconnect Reliability in Advanced Memory Device to cart. $98.04, new condition, Sold by ASHFORD BOOK STORE rated 5.0 out of 5 stars, ships from Weybridge, SURREY, UNITED KINGDOM, published 2023 by Springer International Publishing AG.
Add this copy of Interconnect Reliability in Advanced Memory Device to cart. $175.50, new condition, Sold by Basi6 International rated 5.0 out of 5 stars, ships from Irving, TX, UNITED STATES, published 2024 by Springer.
Add this copy of Interconnect Reliability in Advanced Memory Device to cart. $175.50, new condition, Sold by Basi6 International rated 5.0 out of 5 stars, ships from Irving, TX, UNITED STATES, published 2023 by Springer International Publishing AG.
Add this copy of Interconnect Reliability in Advanced Memory Device to cart. $215.66, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2023 by Springer International Publishing AG.
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Seller's Description:
New. Contains: Illustrations, black & white, Illustrations, color. Springer Series in Reliability Engineering . XVIII, 210 p. 100 illus., 89 illus. in color. Intended for professional and scholarly audience.
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