Packaging engineers now have to work with die level designers to either create a package that performs well at high frequencies or to use readily available low cost packages that happen to meet the needs of the application.
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Packaging engineers now have to work with die level designers to either create a package that performs well at high frequencies or to use readily available low cost packages that happen to meet the needs of the application.
Read Less
Add this copy of Package Electrical Modeling, Thermal Modeling, and to cart. $107.04, new condition, Sold by Basi6 International rated 5.0 out of 5 stars, ships from Irving, TX, UNITED STATES, published 2014 by Springer-Verlag New York Inc..
Add this copy of Package Electrical Modeling, Thermal Modeling, and to cart. $112.32, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2014 by Springer-Verlag New York Inc..
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Seller's Description:
New. Print on demand Contains: Illustrations, black & white. Electronic Packaging and Interconnects . XIV, 234 p. 62 illus. Intended for professional and scholarly audience.
Add this copy of Package Electrical Modeling, Thermal Modeling, and to cart. $76.95, very good condition, Sold by Mike's Library rated 5.0 out of 5 stars, ships from Plymouth, PA, UNITED STATES, published 1998 by Springer.
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Very Good with no dust jacket. 0792383648. Library stamps/marks/labels/pocket, otherwise light wear. Solid hardcover.; "Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications reviews the practical aspects of electrical and thermal modeling of packages and has no equivalent on the market, since it discusses analog (microwave) packaging as opposed to digital packaging. This book emphasizes low-cost industry-standard packages; however, the principles translate well to other categories of packages. The need for this book arises from the fact that low-cost packages have not been optimized for high-frequency use. With high-volume commercial wireless markets now expanding and cost reduction a primary concern, the interest in modeling as a significant cost-cutting tool is high. Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications addresses this interest and need, providing a comprehensive approach to the state-of-the-art modeling and processing techniques that professional engineers are just beginning to utilize. Engineers and professionals in the field of wireless packaging will find this book interesting and of great value to their work."; Electronic Packaging And Interconnects, 2; Ex-Library; 248 pages.
