Presents 15 papers from the November 1996 congress reflecting the state-of-the-art modeling, simulation, and sensing technologies used in emerging electronic packaging applications, especially flip chip and ball grid array (BGA). Subjects include curing analysis of a flip- chip-on-board electronic p
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Presents 15 papers from the November 1996 congress reflecting the state-of-the-art modeling, simulation, and sensing technologies used in emerging electronic packaging applications, especially flip chip and ball grid array (BGA). Subjects include curing analysis of a flip- chip-on-board electronic p
Read Less
Add this copy of Sensing, Modeling and Simulation in Emerging Electronic to cart. $72.53, new condition, Sold by Educational Media Centre rated 4.0 out of 5 stars, ships from New Delhi, DELHI, INDIA, published 1996 by American Society of Mechanical Engineers.
Add this copy of Sensing, Modeling and Simulation in Emerging Electronic to cart. $90.64, new condition, Sold by Basi6 International rated 5.0 out of 5 stars, ships from Irving, TX, UNITED STATES, published 1996 by American Society of Mechanical Engineers.
