Wire bonds are used to interconnect integrated circuits, multichip modules and hybrids, and microwave as well as power devices to their packages. This is a reference on wire bonding. It emphasis on fine pitch bonding, bonding to MCMs, and additional areas.
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Wire bonds are used to interconnect integrated circuits, multichip modules and hybrids, and microwave as well as power devices to their packages. This is a reference on wire bonding. It emphasis on fine pitch bonding, bonding to MCMs, and additional areas.
Read Less
Add this copy of Wire Bonding in Microelectronics: Materials, Processes, to cart. $120.98, very good condition, Sold by ThriftBooks-Dallas rated 4.0 out of 5 stars, ships from Dallas, TX, UNITED STATES, published 1997 by McGraw-Hill Professional.
Add this copy of Wire Bonding in Microelectronics: Materials, Processes, to cart. $184.82, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Santa Clarita, CA, UNITED STATES, published 1997 by McGraw-Hill Professional.
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