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1. Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
by Zhang, Shuye, and Sun, Guoli
Seller Description: New. Print on demand 198 p. Materials, Circuits and Devices . Intended for college/higher education audience. See More Details
2025, Institution of Engineering and Technology
ISBN-13: 9781837241408
Hardcover, New
NV, USA
$119.72
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2. Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
by Zhang, Shuye, and Sun, Guoli
Seller Description: Fine. 199 p. Materials, Circuits and Devices . Intended for college/higher education audience. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
2025, Institution of Engineering and Technology
ISBN-13: 9781837241408
Hardcover, Fine/Like New
Castle Donington, DERBYSHIRE, UNITED KINGDOM
$128.93
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3. Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
by Zhang, Shuye, and Sun, Guoli
Seller Description: New. 199 p. Materials, Circuits and Devices . Intended for college/higher education audience. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
2025, Institution of Engineering and Technology
ISBN-13: 9781837241408
Hardcover, New
Castle Donington, DERBYSHIRE, UNITED KINGDOM
$130.49
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4. Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
by Zhang, Shuye
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2025, Institution of Engineering & Technology
ISBN-13: 9781837241408
Hardcover, New
Fairford, GLOUCESTERSHIRE, UNITED KINGDOM
$166.12
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5. Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
by Zhang, Shuye, and Sun, Guoli
Seller Description: New. 199 p. Materials, Circuits and Devices . Intended for college/higher education audience. See More Details
2025, Institution of Engineering and Technology
ISBN-13: 9781837241408
Hardcover, New
Southport, MERSEYSIDE, UNITED KINGDOM
$179.35
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6. Semiconductor Advanced Packaging
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2022, Springer Verlag, Singapore
ISBN-13: 9789811613784
Paperback, New
New Delhi, DELHI, INDIA
$92.86
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7. Semiconductor Advanced Packaging
Seller Description: Brand New. New. See More Details
2022, Springer Verlag, Singapore
ISBN-13: 9789811613784
Paperback, New
New Delhi, DELHI, INDIA
$101.75
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8. Semiconductor Advanced Packaging
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2022, Springer Verlag, Singapore
ISBN-13: 9789811613784
Paperback, New
Irving, TX, USA
$105.03
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9. Semiconductor Advanced Packaging
by Lau, John H.
Seller Description: New. Contains: Illustrations, black & white, Illustrations, color. XXII, 498 p. 557 illus., 530 illus. in color. Intended for professional and scholarly audience. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 ... See More Details
2022, Springer Verlag, Singapore
ISBN-13: 9789811613784
Paperback, New
Castle Donington, DERBYSHIRE, UNITED KINGDOM
$130.51
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10. Semiconductor Advanced Packaging
by Lau, John H.
Seller Description: New. Print on demand Contains: Illustrations, black & white, Illustrations, color. XXII, 498 p. 557 illus., 530 illus. in color. Intended for professional and scholarly audience. See More Details
2022, Springer Verlag, Singapore
ISBN-13: 9789811613784
Paperback, New
NV, USA
$131.11
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11. Semiconductor Advanced Packaging
by Lau, John H.
Seller Description: New. Contains: Illustrations, black & white, Illustrations, color. XXII, 498 p. 557 illus., 530 illus. in color. Intended for professional and scholarly audience. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 ... See More Details
2022, Springer Verlag, Singapore
ISBN-13: 9789811613784
Paperback, New
Columbia, MD, USA
$138.06
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12. Semiconductor Advanced Packaging
by Lau, John H.
Seller Description: New. Contains: Illustrations, black & white, Illustrations, color. XXII, 498 p. 557 illus., 530 illus. in color. Intended for professional and scholarly audience. See More Details
2022, Springer Verlag, Singapore
ISBN-13: 9789811613784
Paperback, New
Uxbridge, MIDDLESEX, UNITED KINGDOM
$146.94
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13. Semiconductor Advanced Packaging
by Lau, John H.
Seller Description: New. See More Details
2022, Springer
ISBN-13: 9789811613784
paperback, New
Miramar, FL, USA
$157.55
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14. Semiconductor Advanced Packaging
by Lau, John H.
Seller Description: Fine. Contains: Illustrations, black & white, Illustrations, color. XXII, 498 p. 557 illus., 530 illus. in color. Intended for use in adult education. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy ... See More Details
2022, Springer Verlag, Singapore
ISBN-13: 9789811613784
Paperback, Fine/Like New
Columbia, MD, USA
$160.87
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15. Semiconductor Advanced Packaging
by Lau, John H.
Seller Description: Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book. See More Details
2022, Springer
ISBN-13: 9789811613784
paperback, Good
Santa Clarita, CA, USA
$160.88
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16. Semiconductor Advanced Packaging
by Lau, John H.
Seller Description: New. See More Details
2022, Springer
ISBN-13: 9789811613784
paperback, New
Santa Clarita, CA, USA
$204.69
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17. Semiconductor Advanced Packaging
by John H. Lau
eBook See More Details
2021, Springer Nature
eBook ISBN: 9789811613753
Edition: 2021 edition
Format: EPUB eBook
Digital download
$38.70
