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1. Sip System-in-Package Design and Simulation: Mentor Ee Flow Advanced Design Guide
by Li (Li Yang), Suny
Seller Description: Good. It's a well-cared-for item that has seen limited use. The item may show minor signs of wear. All the text is legible, with all pages included. It may have slight markings and/or highlighting. See More Details
2017, Wiley
ISBN-13: 9781119045939
Philadelphia, PA, USA
$129.57
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2. Sip System-in-Package Design and Simulation
by Suny Li
Seller Description: PLEASE NOTE, WE DO NOT SHIP TO DENMARK. New Book. Shipped from UK in 4 to 14 days. Established seller since 2000. Please note we cannot offer an expedited shipping service from the UK. See More Details
2017, Wiley
ISBN-13: 9781119045939
Hardcover, New
Fairford, GLOUCESTERSHIRE, UNITED KINGDOM
$150.03
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3. SiP System-in-Package Design and Simulation: Mentor EE Flow Advanced Design Guide
by Li (Li Yang), Suny
Seller Description: New. Print on demand Intended for professional and scholarly audience. See More Details
2017, John Wiley & Sons Inc
ISBN-13: 9781119045939
Hardcover, New
NV, USA
$153.25
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4. SiP System-in-Package Design and Simulation: Mentor EE Flow Advanced Design Guide
by Li (Li Yang), Suny
Seller Description: New. Intended for professional and scholarly audience. See More Details
2017, John Wiley & Sons Inc
ISBN-13: 9781119045939
Hardcover, New
Uxbridge, MIDDLESEX, UNITED KINGDOM
$156.57
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5. Sip System-in-Package Design and Simulation
by Suny Li (Li Yang)
Seller Description: New Book. Shipped from UK in 4 to 14 days. Established seller since 2000. Please note we cannot offer an expedited shipping service from the UK. See More Details
2017, Wiley
ISBN-13: 9781119045939
Hardcover, New
Bensenville, IL, USA
$178.31
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6. Sip System-in-Package Design and Simulation: Mentor Ee Flow Advanced Design Guide
by Li (Li Yang), Suny
Seller Description: Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book. See More Details
2017, Wiley
ISBN-13: 9781119045939
hardcover, Good
Santa Clarita, CA, USA
$181.60
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7. Sip-System in Package Design and Simulation
by Yang, Liu
Seller Description: New. An advanced reference documenting, in detail, every step of a real System in Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor Graphics Expedition Enterprise Flow. Num Pages: 400 pages. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 220 x 154 x 23. Weight in Grams: 666. 2017. Hardback.....We ship daily from our Bookshop. See More Details
2017, John Wiley & Sons Inc
ISBN-13: 9781119045939
Hardcover, New
Galway, IRELAND
$186.12
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8. SiP System-in-Package Design and Simulation: Mentor EE Flow Advanced Design Guide
by Li (Li Yang), Suny
Seller Description: New. Intended for professional and scholarly audience. See More Details
2017, John Wiley & Sons Inc
ISBN-13: 9781119045939
Hardcover, New
Southport, MERSEYSIDE, UNITED KINGDOM
$189.98
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9. Physical Design for Multichip Modules
Seller Description: New, Satisfaction guaranteed! ! See More Details
2012, Springer
ISBN-13: 9781461361534
Paperback, New
Irving, TX, USA
$138.46
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10. Multi-Chip Module Test Strategies (Frontiers in Electronic Testing)
Seller Description: New. See More Details
2012, Springer
ISBN-13: 9781461377986
paperback, New
Miramar, FL, USA
$162.88
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11. Physical Design for Multichip Modules
by Sriram, Mysore, and Sung-Mo (Steve) Kang
Seller Description: New. Print on demand Trade paperback (US). Glued binding. 197 p. The Springer International Engineering and Computer Science, 267. See More Details
2012, Springer
ISBN-13: 9781461361534
Trade paperback, New
NV, USA
$168.69
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12. Physical Design for Multichip Modules
by Sriram, Mysore, and Sung-Mo (Steve) Kang
Seller Description: New. Trade paperback (US). Glued binding. 197 p. The Springer International Engineering and Computer Science, 267. See More Details
2012, Springer
ISBN-13: 9781461361534
Trade paperback, New
Uxbridge, MIDDLESEX, UNITED KINGDOM
$192.20
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13. MCM C/Mixed Technologies and Thick Film Sensors
by Jones, W K (Editor), and Kurzweil, Karel (Editor), and Harsányi, Gábor (Editor)
Seller Description: New. Trade paperback (US). Glued binding. 318 p. NATO Science Partnership Subseries: 3, 2. See More Details
2012, Springer
ISBN-13: 9789401040396
Trade paperback, New
NV, USA
$215.66
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14. Multichip Modules with Integrated Sensors
by Jones, W K (Editor), and Harsányi, Gábor (Editor)
Seller Description: New. Print on demand Trade paperback (US). Glued binding. 336 p. NATO Science Partnership Subseries: 3, 16. See More Details
2011, Springer
ISBN-13: 9789401066310
Trade paperback, New
NV, USA
$112.32
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15. Multichip Modules With Integrated Sensors
Seller Description: New, Satisfaction guaranteed! ! See More Details
2011, Springer
ISBN-13: 9789401066310
Paperback, New
Irving, TX, USA
$113.91
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16. Multichip Modules with Integrated Sensors
by Jones, W K (Editor), and Harsányi, Gábor (Editor)
Seller Description: Fine. Trade paperback (US). Glued binding. 336 p. NATO Science Partnership Subseries: 3, 16. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
2011, Springer
ISBN-13: 9789401066310
Trade paperback, Fine/Like New
Castle Donington, DERBYSHIRE, UNITED KINGDOM
$121.20
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17. Multichip Modules with Integrated Sensors
by Jones, W K (Editor), and Harsányi, Gábor (Editor)
Seller Description: New. Trade paperback (US). Glued binding. 336 p. NATO Science Partnership Subseries: 3, 16. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
2011, Springer
ISBN-13: 9789401066310
Trade paperback, New
Castle Donington, DERBYSHIRE, UNITED KINGDOM
$122.42
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18. Multichip Modules with Integrated Sensors
by Jones, W K (Editor), and Harsányi, Gábor (Editor)
Seller Description: Fine. Trade paperback (US). Glued binding. 336 p. NATO Science Partnership Subseries: 3, 16. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
2011, Springer
ISBN-13: 9789401066310
Trade paperback, Fine/Like New
Columbia, MD, USA
$124.36
