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51. Area Array Packaging Processes: for Bga, Flip Chip, and Csp
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2003, McGraw-Hill Professional Publishing
ISBN-13: 9780071428293
Irving, TX, USA
$88.84
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52. Area Array Packaging Processes: for Bga, Flip Chip, and Csp
by Ken Gilleo,
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2003, McGraw-Hill Professional Publishing
ISBN-13: 9780071428293
New Delhi, DELHI, INDIA
$101.45
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53. Area Array Packaging Processes: for Bga, Flip Chip, and Csp
Seller Description: New, US edition. Satisfaction guaranteed! ! See More Details
2003, McGraw-Hill Professional Publishing
ISBN-13: 9780071428293
Irving, TX, USA
$110.06
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54. Area Array Packaging Processes: for Bga, Flip Chip, and Csp
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2003, McGraw-Hill Professional Publishing
ISBN-13: 9780071428293
Sterling Heights, MI, USA
$110.06
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55. Area Array Packaging Processes: for Bga, Flip Chip, and Csp
Seller Description: New, Satisfaction guaranteed! ! See More Details
2003, McGraw-Hill Professional Publishing
ISBN-13: 9780071428293
Irving, TX, USA
$111.06
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56. Area Array Packaging Processes
by Ken Gilleo
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2003, McGraw-Hill Education LLC (Professional Pod)
ISBN-13: 9780071738019
Softcover, New
Fairford, GLOUCESTERSHIRE, UNITED KINGDOM
$137.36
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57. Area Array Packaging Processes
by Gilleo, Ken
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2003, McGraw-Hill Professional
ISBN-13: 9780071738019
Trade paperback, New
Castle Donington, DERBYSHIRE, UNITED KINGDOM
$137.87
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58. Area Array Packaging Processes
by Gilleo, Ken
Seller Description: Fine. Trade paperback (US). 272 p. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
2003, McGraw-Hill Professional
ISBN-13: 9780071738019
Trade paperback, Fine/Like New
Castle Donington, DERBYSHIRE, UNITED KINGDOM
$139.54
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59. Area Array Packaging Processes
by Gilleo, Ken
Seller Description: Fine. Trade paperback (US). 272 p. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
2003, McGraw-Hill Professional
ISBN-13: 9780071738019
Trade paperback, Fine/Like New
Columbia, MD, USA
$142.77
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60. Area Array Packaging Processes
by Gilleo, Ken
Seller Description: New. Trade paperback (US). 272 p. See More Details
2003, McGraw-Hill Professional
ISBN-13: 9780071738019
Trade paperback, New
Uxbridge, MIDDLESEX, UNITED KINGDOM
$143.83
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61. Area Array Packaging Processes
by Gilleo, Ken
Seller Description: New. Trade paperback (US). 272 p. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
2003, McGraw-Hill Professional
ISBN-13: 9780071738019
Trade paperback, New
Columbia, MD, USA
$144.14
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62. Area Array Packaging Processes
by Gilleo, Ken
Seller Description: New. Print on demand Trade paperback (US). 272 p. See More Details
2003, McGraw-Hill Professional
ISBN-13: 9780071738019
Trade paperback, New
NV, USA
$146.15
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63. Area Array Packaging Processes
by Gilleo, Ken
Seller Description: New Book. Shipped from UK in 4 to 14 days. Established seller since 2000. Please note we cannot offer an expedited shipping service from the UK. See More Details
2003, McGraw-Hill Education LLC (Professional Pod)
ISBN-13: 9780071738019
Softcover, New
Bensenville, IL, USA
$161.49
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64. Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies
by John H. Lau
Seller Description: Good. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less. See More Details
2000, McGraw-Hill Professional
ISBN-13: 9780071351416
Hardcover, Good
Dallas, TX, USA
$56.96
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65. Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies
by Lau, John H.
Seller Description: Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book. See More Details
2000, McGraw-Hill Professional
ISBN-13: 9780071351416
hardcover, Good
Santa Clarita, CA, USA
$118.91
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66. Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies
by Lau, John H.
Seller Description: New. See More Details
2000, McGraw-Hill Professional
ISBN-13: 9780071351416
hardcover, New
Miramar, FL, USA
$165.41
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67. Advanced Electronic Packaging: With Emphasis on Multichip Modules (Ieee Press Series on Microelectronic Systems)
by Brown, William D. [Editor]
Seller Description: Good. Size: 7x1x10; Ex-library book with typical stickers and stampings. NO Priority Mail is available on this item. No international shipping. See More Details
1998, Wiley-IEEE Press
ISBN-13: 9780780347007
hardcover, Good
West Valley, UT, USA
$29.19
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68. Advanced Electronic Packaging: With Emphasis on Multichip Modules (Ieee Press Series on Microelectronic Systems)
Seller Description: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority! See More Details
1998, Wiley-IEEE Press
ISBN-13: 9780780347007
hardcover, Good
Dallas, TX, USA
$30.75
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69. Advanced Electronic Packaging: With Emphasis on Multichip Modules (Ieee Press Series on Microelectronic Systems)
Seller Description: Supports Goodwill of Silicon Valley job training programs. The cover and pages are in very good condition! The cover and any other included accessories are also in very good condition showing some minor use. The spine is straight there are no rips tears or creases on the cover or the pages. See More Details
1998, Wiley-IEEE Press
ISBN-13: 9780780347007
Hardcover, Very Good
San Jose, CA, USA
$34.74
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70. Advanced Electronic Packaging: With Emphasis on Multichip Modules (Ieee Press Series on Microelectronic Systems) Brown, William D.
by Brown, William D. [Editor]
Seller Description: Very Good. Book is in very nice condition, text is unmarked and pages are tight. See More Details
1998, Wiley-IEEE Press
ISBN-13: 9780780347007
Hardcover, Very Good
Branchville, NJ, USA
$46.95
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