-
76. Thermal Management Handbook: for Electronic Assemblies
by Sergent, Jerry E.
Seller Description: Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book. See More Details
1998, McGraw Hill
ISBN-13: 9780070266995
hardcover, Good
Santa Clarita, CA, USA
$101.30
-
77. Thermal Management Handbook: for Electronic Assemblies
by Sergent, Jerry E.
Seller Description: New. See More Details
1998, McGraw Hill
ISBN-13: 9780070266995
hardcover, New
Miramar, FL, USA
$144.01
-
78. Thermal Management Handbook: for Electronic Assemblies
by Sergent, Jerry; Krum, Al; Imaps (Ishm)
Seller Description: New. Size: 9x6x1; New. In shrink wrap. Looks like an interesting title! See More Details
1998, McGraw-Hill Education
ISBN-13: 9780070266995
Hardcover, New
San Diego, CA, USA
$175.95
-
79. Thermal Management Handbook: for Electronic Assemblies
by Sergent, Jerry E.
Seller Description: New. See More Details
1998, McGraw Hill
ISBN-13: 9780070266995
hardcover, New
Santa Clarita, CA, USA
$219.28
-
80. Multichip Module Technology Handbook
by Imaps (Ishm)
Seller Description: Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book. See More Details
1997, McGraw-Hill Professional
ISBN-13: 9780070228948
hardcover, Good
Santa Clarita, CA, USA
$103.68
-
81. Multi-Chip Module Test Strategies
by Zorian, Yervant (Editor)
Seller Description: New. Sewn binding. Cloth over boards. 167 p. Contains: Unspecified. Frontiers in Electronic Testing, 7. See More Details
1997, Springer
ISBN-13: 9780792399209
Hardcover, New
NV, USA
$112.32
-
82. Multichip Module Technology Handbook
by Imaps (Ishm)
Seller Description: New. See More Details
1997, McGraw-Hill Professional
ISBN-13: 9780070228948
hardcover, New
Miramar, FL, USA
$146.95
-
83. Sensing, Modeling and Simulation in Emerging Electronic Packaging
by 0
Seller Description: Brand New. New. See More Details
1996, American Society of Mechanical Engineers
ISBN-13: 9780791815489
Paperback, New
New Delhi, DELHI, INDIA
$72.53
-
84. Sensing, Modeling and Simulation in Emerging Electronic Packaging
Seller Description: New, US edition. Satisfaction guaranteed! ! See More Details
1996, American Society of Mechanical Engineers
ISBN-13: 9780791815489
Paperback, New
Irving, TX, USA
$90.64
-
85. High Performance Design Automation. (V5)
by Cho Jun Dong
eBook See More Details
1996, World Scientific Publishing
eBook ISBN: 9789810223076
Format: PDF eBook
Digital download
$155.00
-
86. Flip Chip Technologies
by Lau, John H.
Seller Description: Fine. See More Details
1995, McGraw-Hill Professional
ISBN-13: 9780070366091
Hardcover, Fine/Like New
South El Monte, CA, USA
$46.94
-
87. Flip Chip Technologies
by John H. Lau
Seller Description: Good. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less. See More Details
1995, McGraw-Hill Professional
ISBN-13: 9780070366091
Hardcover, Good
Dallas, TX, USA
$47.93
-
88. Flip Chip Technologies
by Lau, John H.
Seller Description: Very good. See More Details
1995, McGraw-Hill Professional
ISBN-13: 9780070366091
Hardcover, Very Good
North Smithfield, RI, USA
$50.13
-
89. Routing in the Third Dimension: From Vlsi Chips to McMs (Ieee Press Series on Microelectronic Systems)
by Sherwani, Naveed A.
Seller Description: Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book. See More Details
1995, Wiley-IEEE Press
ISBN-13: 9780780310896
hardcover, Good
Santa Clarita, CA, USA
$80.37
-
90. Flip Chip Technologies
by Lau, John H.
Seller Description: New. Size: 9x6x1; New. In shrink wrap. Looks like an interesting title! See More Details
1995, McGraw-Hill Professional
ISBN-13: 9780070366091
Hardcover, New
San Diego, CA, USA
$105.50
-
91. McM C/Mixed Technologies and Thick Film Sensors (Nato Science Partnership Subseries: 3, 2)
Seller Description: Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book. See More Details
1995, Springer
ISBN-13: 9780792334606
hardcover, Good
Santa Clarita, CA, USA
$114.79
-
92. Flip Chip Technologies
by Lau, John H.
Seller Description: New. See More Details
1995, McGraw-Hill Professional
ISBN-13: 9780070366091
hardcover, New
Miramar, FL, USA
$129.33
-
93. MCM C/Mixed Technologies and Thick Film Sensors
by Jones, W K (Editor), and Kurzweil, Karel (Editor), and Harsányi, Gábor (Editor)
Seller Description: New. Print on demand Sewn binding. Cloth over boards. 318 p. Contains: Unspecified. NATO Science Partnership Subseries: 3, 2. See More Details
1995, Springer
ISBN-13: 9780792334606
Hardcover, New
NV, USA
$215.66
-
94. Multichip Module Design, Fabrication, and Testing (Electronic Packaging and Interconnection)
by James J. Licari
Seller Description: Fine. Pages are clean and are not marred by notes or folds of any kind. ~ ThriftBooks: Read More, Spend Less. See More Details
1994, McGraw-Hill
ISBN-13: 9780070377158
Hardcover, Fine/Like New
Reno, NV, USA
$18.00
-
95. Electronics Packaging Forum: Multichip Module Technology Issues
by Morris, James E.
Seller Description: Very Good in Printed Boards jacket. 8vo-over 7¾"-9¾" tall. 392 pp. Tightly bound. Corners not bumped. Text is free of markings. No ownership markings. Published without dust jacket. Printed boards. See More Details
1994, IEEE Press
ISBN-13: 9780780304390
Hardcover, Very Good
West Brookfield, MA, USA
$18.00
-
96. Multichip Module Design, Fabrication, and Testing (Electronic Packaging and Interconnection)
by Licari, James J.
Seller Description: Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book. See More Details
1994, McGraw-Hill
ISBN-13: 9780070377158
hardcover, Good
Santa Clarita, CA, USA
$47.61
-
97. Electronics Packaging Forum: Multichip Module Technology Issues
Seller Description: Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book. See More Details
1994, IEEE
ISBN-13: 9780780304390
hardcover, Good
Santa Clarita, CA, USA
$48.26
|
