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101. Physical Design for Multichip Modules
Seller Description: New, Satisfaction guaranteed! ! See More Details
1994, Springer
ISBN-13: 9780792394501
Irving, TX, USA
$138.46
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102. Physical Design for Multichip Modules
by Sriram, Mysore, and Sung-Mo (Steve) Kang
Seller Description: New. Print on demand Sewn binding. Cloth over boards. 197 p. Contains: Unspecified. The Springer International Engineering and Computer Science, 267. See More Details
1994, Springer
ISBN-13: 9780792394501
Hardcover, New
NV, USA
$168.69
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103. Physical Design for Multichip Modules
by Sriram, Mysore, and Sung-Mo (Steve) Kang
Seller Description: Fine. Sewn binding. Cloth over boards. 197 p. Contains: Unspecified. The Springer International Engineering and Computer Science, 267. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
1994, Springer
ISBN-13: 9780792394501
Hardcover, Fine/Like New
Columbia, MD, USA
$178.01
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104. Physical Design for Multichip Modules
by Sriram, Mysore, and Sung-Mo (Steve) Kang
Seller Description: New. Sewn binding. Cloth over boards. 197 p. Contains: Unspecified. The Springer International Engineering and Computer Science, 267. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
1994, Springer
ISBN-13: 9780792394501
Hardcover, New
Columbia, MD, USA
$178.53
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105. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: a Focus on Reliability
by Pecht, Michael
Seller Description: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority! See More Details
1994, Wiley-Interscience
ISBN-13: 9780471594468
Hardcover, Good
Dallas, TX, USA
$180.63
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106. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
by Pecht, Michael G
Seller Description: Fine. Sewn binding. Cloth over boards. 464 p. Contains: Unspecified. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
1994, Wiley-Interscience
ISBN-13: 9780471594468
Hardcover, Fine/Like New
Columbia, MD, USA
$181.38
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107. Physical Design for Multichip Modules
by Sriram, Mysore, and Sung-Mo (Steve) Kang
Seller Description: Fine. Sewn binding. Cloth over boards. 197 p. Contains: Unspecified. The Springer International Engineering and Computer Science, 267. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
1994, Springer
ISBN-13: 9780792394501
Hardcover, Fine/Like New
Castle Donington, DERBYSHIRE, UNITED KINGDOM
$182.01
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108. Physical Design for Multichip Modules
by Sriram, Mysore, and Sung-Mo (Steve) Kang
Seller Description: New. Sewn binding. Cloth over boards. 197 p. Contains: Unspecified. The Springer International Engineering and Computer Science, 267. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
1994, Springer
ISBN-13: 9780792394501
Hardcover, New
Castle Donington, DERBYSHIRE, UNITED KINGDOM
$183.85
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109. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
by Pecht, Michael G
Seller Description: New. Sewn binding. Cloth over boards. 464 p. Contains: Unspecified. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
1994, Wiley-Interscience
ISBN-13: 9780471594468
Hardcover, New
Columbia, MD, USA
$189.89
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110. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
by Pecht, Michael G
Seller Description: New. Sewn binding. Cloth over boards. 464 p. Contains: Unspecified. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
1994, Wiley-Interscience
ISBN-13: 9780471594468
Hardcover, New
Castle Donington, DERBYSHIRE, UNITED KINGDOM
$190.37
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111. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
by Michael G. Pecht
Seller Description: PLEASE NOTE, WE DO NOT SHIP TO DENMARK. New Book. Shipped from UK in 4 to 14 days. Established seller since 2000. Please note we cannot offer an expedited shipping service from the UK. See More Details
1994, Wiley
ISBN-13: 9780471594468
Hardcover, New
Fairford, GLOUCESTERSHIRE, UNITED KINGDOM
$190.38
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112. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
by Pecht, Michael
Seller Description: New. Print on demand Sewn binding. Cloth over boards. 464 p. Contains: Unspecified. See More Details
1994, Wiley-Interscience
ISBN-13: 9780471594468
Hardcover, New
NV, USA
$191.90
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113. Physical Design for Multichip Modules
by Sriram, Mysore, and Sung-Mo (Steve) Kang
Seller Description: New. Sewn binding. Cloth over boards. 197 p. Contains: Unspecified. The Springer International Engineering and Computer Science, 267. See More Details
1994, Springer
ISBN-13: 9780792394501
Hardcover, New
Uxbridge, MIDDLESEX, UNITED KINGDOM
$192.20
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114. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
by Pecht, Michael G
Seller Description: Fine. Sewn binding. Cloth over boards. 464 p. Contains: Unspecified. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
1994, Wiley-Interscience
ISBN-13: 9780471594468
Hardcover, Fine/Like New
Castle Donington, DERBYSHIRE, UNITED KINGDOM
$196.87
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115. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
by Pecht, Michael G
Seller Description: New. Sewn binding. Cloth over boards. 464 p. Contains: Unspecified. See More Details
1994, Wiley-Interscience
ISBN-13: 9780471594468
Hardcover, New
Uxbridge, MIDDLESEX, UNITED KINGDOM
$213.20
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116. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
by Pecht, Michael G
Seller Description: New. Sewn binding. Cloth over boards. 464 p. Contains: Unspecified. See More Details
1994, Wiley-Interscience
ISBN-13: 9780471594468
Hardcover, New
Southport, MERSEYSIDE, UNITED KINGDOM
$238.88
