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176. Hybrid Assemblies and Multichip Modules
by Kear
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1992, CRC Press
ISBN-13: 9780824784669
Hardcover, New
NV, USA
$220.37
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177. Hybrid Assemblies and Multichip Modules
by Fred W. Kear
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1992, Taylor & Francis
eBook ISBN: 9780824784669
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178. Hybrid Assemblies and Multichip Modules (Manufacturing Engineering and Materials Processing)
by Kear, Fred W.
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1992, CRC Press
ISBN-13: 9780824784669
hardcover, New
Miramar, FL, USA
$234.58
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179. Hybrid Assemblies and Multichip Modules
by Kear
Seller Description: New. Sewn binding. Cloth over boards. 296 p. Manufacturing, Engineering and Materials Processing, 38. Intended for a young adult/teenage audience. See More Details
1992, CRC Press
ISBN-13: 9780824784669
Hardcover, New
Southport, MERSEYSIDE, UNITED KINGDOM
$250.63
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180. Multichip Modules-Systems Advantages, Major Constructions and Materials Technologies
by Johnson, R. W.,
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1991, Institute of Electrical & Electronics Engineers(IEEE)
ISBN-13: 9780879422677
New Delhi, DELHI, INDIA
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181. Multichip Modules-Systems Advantages, Major Constructions and Materials Technologies
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1991, Institute of Electrical & Electronics Engineers(IEEE)
ISBN-13: 9780879422677
Irving, TX, USA
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182. Multichip Modules-Systems Advantages, Major Constructions and Materials Technologies
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1991, Institute of Electrical & Electronics Engineers(IEEE)
ISBN-13: 9780879422677
Sterling Heights, MI, USA
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183. Multichip Modules-Systems Advantages, Major Constructions and Materials Technologies
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1991, Institute of Electrical & Electronics Engineers(IEEE)
ISBN-13: 9780879422677
Irving, TX, USA
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184. Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies (Ieee Press Selected Reprint Series)
by Teng, Robert K. F.
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1991, IEEE
ISBN-13: 9780879422677
hardcover, Good
Santa Clarita, CA, USA
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185. Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies (Ieee Press Selected Reprint Series)
by Teng, Robert K. F.
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1991, IEEE
ISBN-13: 9780879422677
hardcover, New
Miramar, FL, USA
$146.70
