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51. System on Package: Miniaturization of the Entire System
by Tummala, Rao
Seller Description: New. Sewn binding. Cloth over boards. 785 p. Contains: Unspecified, Tables, black & white, Figures. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
2007, McGraw-Hill Companies
ISBN-13: 9780071459068
Hardcover, New
Castle Donington, DERBYSHIRE, UNITED KINGDOM
$172.00
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52. System-in-Package Rf Design and Applications
by Michael P. Gaynor
Seller Description: New. See More Details
2007, Artech House Publishers
ISBN-13: 9781580539050
hardcover, New
Miramar, FL, USA
$173.23
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53. Area Array Packaging Processes: for Bga, Flip Chip, and Csp
Seller Description: Brand New. New. See More Details
2003, McGraw-Hill Professional Publishing
ISBN-13: 9780071428293
New Delhi, DELHI, INDIA
$104.10
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54. Area Array Packaging Processes: for Bga, Flip Chip, and Csp
by Ken Gilleo,
Seller Description: Brand New. New. See More Details
2003, McGraw-Hill Professional Publishing
ISBN-13: 9780071428293
New Delhi, DELHI, INDIA
$105.17
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55. Area Array Packaging Processes: for Bga, Flip Chip, and Csp
Seller Description: New, Satisfaction guaranteed! ! See More Details
2003, McGraw-Hill Professional Publishing
ISBN-13: 9780071428293
Irving, TX, USA
$110.22
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56. Area Array Packaging Processes: for Bga, Flip Chip, and Csp
Seller Description: New, US edition. Satisfaction guaranteed! ! See More Details
2003, McGraw-Hill Professional Publishing
ISBN-13: 9780071428293
Irving, TX, USA
$110.32
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57. Area Array Packaging Processes: for Bga, Flip Chip, and Csp
Seller Description: Brand New. New Book Original US edition, We Ship to PO BOX Address also. See More Details
2003, McGraw-Hill Professional Publishing
ISBN-13: 9780071428293
Sterling Heights, MI, USA
$110.32
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58. Area Array Packaging Processes
by Ken Gilleo
Seller Description: PLEASE NOTE, WE DO NOT SHIP TO DENMARK. New Book. Shipped from UK in 4 to 14 days. Established seller since 2000. Please note we cannot offer an expedited shipping service from the UK. See More Details
2003, McGraw-Hill Education LLC (Professional Pod)
ISBN-13: 9780071738019
Softcover, New
Fairford, GLOUCESTERSHIRE, UNITED KINGDOM
$137.36
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59. Area Array Packaging Processes
by Gilleo, Ken
Seller Description: New. Trade paperback (US). 272 p. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
2003, McGraw-Hill Professional
ISBN-13: 9780071738019
Trade paperback, New
Castle Donington, DERBYSHIRE, UNITED KINGDOM
$137.87
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60. Area Array Packaging Processes
by Gilleo, Ken
Seller Description: Fine. Trade paperback (US). 272 p. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
2003, McGraw-Hill Professional
ISBN-13: 9780071738019
Trade paperback, Fine/Like New
Castle Donington, DERBYSHIRE, UNITED KINGDOM
$139.54
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61. Area Array Packaging Processes
by Gilleo, Ken
Seller Description: Fine. Trade paperback (US). 272 p. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
2003, McGraw-Hill Professional
ISBN-13: 9780071738019
Trade paperback, Fine/Like New
Columbia, MD, USA
$142.77
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62. Area Array Packaging Processes
by Gilleo, Ken
Seller Description: New. Trade paperback (US). 272 p. See More Details
2003, McGraw-Hill Professional
ISBN-13: 9780071738019
Trade paperback, New
Uxbridge, MIDDLESEX, UNITED KINGDOM
$143.83
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63. Area Array Packaging Processes
by Gilleo, Ken
Seller Description: New. Trade paperback (US). 272 p. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
2003, McGraw-Hill Professional
ISBN-13: 9780071738019
Trade paperback, New
Columbia, MD, USA
$144.14
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64. Area Array Packaging Processes
by Gilleo, Ken
Seller Description: New. Print on demand Trade paperback (US). 272 p. See More Details
2003, McGraw-Hill Professional
ISBN-13: 9780071738019
Trade paperback, New
NV, USA
$146.15
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65. Area Array Packaging Processes
by Gilleo, Ken
Seller Description: New Book. Shipped from UK in 4 to 14 days. Established seller since 2000. Please note we cannot offer an expedited shipping service from the UK. See More Details
2003, McGraw-Hill Education LLC (Professional Pod)
ISBN-13: 9780071738019
Softcover, New
Bensenville, IL, USA
$161.49
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66. Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies
by John H. Lau
Seller Description: Good. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less. See More Details
2000, McGraw-Hill Professional
ISBN-13: 9780071351416
Hardcover, Good
Dallas, TX, USA
$56.96
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67. Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies
by Lau, John H.
Seller Description: Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book. See More Details
2000, McGraw-Hill Professional
ISBN-13: 9780071351416
hardcover, Good
Santa Clarita, CA, USA
$118.91
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68. Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies
by Lau, John H.
Seller Description: New. See More Details
2000, McGraw-Hill Professional
ISBN-13: 9780071351416
hardcover, New
Miramar, FL, USA
$165.41
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69. Advanced Electronic Packaging: With Emphasis on Multichip Modules (Ieee Press Series on Microelectronic Systems)
by Brown, William D. [Editor]
Seller Description: Good. Size: 7x1x10; Ex-library book with typical stickers and stampings. NO Priority Mail is available on this item. No international shipping. See More Details
1998, Wiley-IEEE Press
ISBN-13: 9780780347007
hardcover, Good
West Valley, UT, USA
$29.19
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