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76. Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies
by John H. Lau
Seller Description: Good. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less. See More Details
2000, McGraw-Hill Professional
ISBN-13: 9780071351416
Hardcover, Good
Dallas, TX, USA
$56.96
-
77. Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies
by Lau, John H.
Seller Description: Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book. See More Details
2000, McGraw-Hill Professional
ISBN-13: 9780071351416
hardcover, Good
Santa Clarita, CA, USA
$118.91
-
78. Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies
by Lau, John H.
Seller Description: New. See More Details
2000, McGraw-Hill Professional
ISBN-13: 9780071351416
hardcover, New
Miramar, FL, USA
$165.41
-
79. Advanced Electronic Packaging: With Emphasis on Multichip Modules (Ieee Press Series on Microelectronic Systems)
by Brown, William D. [Editor]
Seller Description: Good. Size: 7x1x10; Ex-library book with typical stickers and stampings. NO Priority Mail is available on this item. No international shipping. See More Details
1998, Wiley-IEEE Press
ISBN-13: 9780780347007
hardcover, Good
West Valley, UT, USA
$29.19
-
80. Advanced Electronic Packaging: With Emphasis on Multichip Modules (Ieee Press Series on Microelectronic Systems)
Seller Description: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority! See More Details
1998, Wiley-IEEE Press
ISBN-13: 9780780347007
hardcover, Good
Dallas, TX, USA
$30.75
-
81. Advanced Electronic Packaging: With Emphasis on Multichip Modules (Ieee Press Series on Microelectronic Systems)
by Brown, William D.
Seller Description: Very good. See More Details
1998, Wiley-IEEE Press
ISBN-13: 9780780347007
Hardcover, Very Good
North Smithfield, RI, USA
$32.94
-
82. Advanced Electronic Packaging: With Emphasis on Multichip Modules (Ieee Press Series on Microelectronic Systems)
Seller Description: Supports Goodwill of Silicon Valley job training programs. The cover and pages are in very good condition! The cover and any other included accessories are also in very good condition showing some minor use. The spine is straight there are no rips tears or creases on the cover or the pages. See More Details
1998, Wiley-IEEE Press
ISBN-13: 9780780347007
Hardcover, Very Good
San Jose, CA, USA
$34.74
-
83. Thermal Management Handbook: for Electronic Assemblies
by Sergent, Jerry E. |Krum, Al|Imaps (Ishm)
Seller Description: The book is in good condition with all pages and cover intact including the dust jacket if originally issued. The spine may show light wear. Pages may contain some notes or highlighting and there might be a From the library of label. Boxed set packaging shrink wrap or included media like CDs may be missing. See More Details
1998, McGraw Hill
ISBN-13: 9780070266995
Hardcover, Good
North Smithfield, RI, USA
$58.64
-
84. Multichip Module Technology Handbook
by Garrou, Philip
Seller Description: This is an ex-library book and may have the usual library/used-book markings inside. This book has hardback covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item, 1650grams, ISBN: 9780070228948. See More Details
1998, McGraw-Hill
ISBN-13: 9780070228948
Hardcover, Good
Lincoln, UNITED KINGDOM
$70.34
-
85. Thermal Management Handbook: for Electronic Assemblies
by Sergent, Jerry E.
Seller Description: Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book. See More Details
1998, McGraw Hill
ISBN-13: 9780070266995
hardcover, Good
Santa Clarita, CA, USA
$101.30
-
86. Thermal Management Handbook: for Electronic Assemblies
by Sergent, Jerry E.
Seller Description: New. See More Details
1998, McGraw Hill
ISBN-13: 9780070266995
hardcover, New
Miramar, FL, USA
$144.01
-
87. Thermal Management Handbook: for Electronic Assemblies
by Sergent, Jerry; Krum, Al; Imaps (Ishm)
Seller Description: New. Size: 9x6x1; New. In shrink wrap. Looks like an interesting title! See More Details
1998, McGraw-Hill Education
ISBN-13: 9780070266995
Hardcover, New
San Diego, CA, USA
$175.95
-
88. Thermal Management Handbook: for Electronic Assemblies
by Sergent, Jerry E.
Seller Description: New. See More Details
1998, McGraw Hill
ISBN-13: 9780070266995
hardcover, New
Santa Clarita, CA, USA
$219.28
-
89. Multi-Chip Module Test Strategies
Seller Description: Brand New. New. See More Details
1997, Springer
ISBN-13: 9780792399209
New Delhi, DELHI, INDIA
$81.74
-
90. Multi-Chip Module Test Strategies
Seller Description: New, US edition. Satisfaction guaranteed! ! See More Details
1997, Springer
ISBN-13: 9780792399209
Irving, TX, USA
$100.17
-
91. Multichip Module Technology Handbook
by Imaps (Ishm)
Seller Description: Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book. See More Details
1997, McGraw-Hill Professional
ISBN-13: 9780070228948
hardcover, Good
Santa Clarita, CA, USA
$103.68
-
92. Multi-Chip Module Test Strategies
by Zorian, Yervant (Editor)
Seller Description: New. Sewn binding. Cloth over boards. 167 p. Contains: Unspecified. Frontiers in Electronic Testing, 7. See More Details
1997, Springer
ISBN-13: 9780792399209
Hardcover, New
NV, USA
$112.32
-
93. Multichip Module Technology Handbook
by Imaps (Ishm)
Seller Description: New. See More Details
1997, McGraw-Hill Professional
ISBN-13: 9780070228948
hardcover, New
Miramar, FL, USA
$146.95
-
94. Sensing, Modeling and Simulation in Emerging Electronic Packaging
by 0
Seller Description: Brand New. New. See More Details
1996, American Society of Mechanical Engineers
ISBN-13: 9780791815489
Paperback, New
New Delhi, DELHI, INDIA
$73.69
-
95. High Performance Design Automation. (V5)
by Cho Jun Dong
eBook See More Details
1996, World Scientific Publishing
eBook ISBN: 9789810223076
Format: PDF eBook
Digital download
$155.00
-
96. Flip Chip Technologies
by Lau, John H.
Seller Description: Fine. See More Details
1995, McGraw-Hill Professional
ISBN-13: 9780070366091
Hardcover, Fine/Like New
South El Monte, CA, USA
$46.92
-
97. Flip Chip Technologies
by John H. Lau
Seller Description: Very good. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less. See More Details
1995, McGraw-Hill Professional
ISBN-13: 9780070366091
Hardcover, Very Good
Austell, GA, USA
$47.91
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