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101. Flip Chip Technologies
by John H. Lau
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1995, McGraw-Hill Professional
ISBN-13: 9780070366091
Hardcover, Good
Dallas, TX, USA
$47.91
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102. Flip Chip Technologies
by Lau, John H.
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1995, McGraw-Hill Professional
ISBN-13: 9780070366091
Hardcover, Very Good
North Smithfield, RI, USA
$50.11
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103. Routing in the Third Dimension: From Vlsi Chips to McMs (Ieee Press Series on Microelectronic Systems)
by Sherwani, Naveed A.
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1995, Wiley-IEEE Press
ISBN-13: 9780780310896
hardcover, Good
Santa Clarita, CA, USA
$80.37
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104. Flip Chip Technologies
by Lau, John H.
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1995, McGraw-Hill Professional
ISBN-13: 9780070366091
hardcover, Good
Santa Clarita, CA, USA
$89.21
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105. Flip Chip Technologies
by Lau, John H.
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1995, McGraw-Hill Professional
ISBN-13: 9780070366091
Hardcover, New
San Diego, CA, USA
$105.50
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106. McM C/Mixed Technologies and Thick Film Sensors (Nato Science Partnership Subseries: 3, 2)
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1995, Springer
ISBN-13: 9780792334606
hardcover, Good
Santa Clarita, CA, USA
$114.79
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107. Flip Chip Technologies
by Lau, John H.
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1995, McGraw-Hill Professional
ISBN-13: 9780070366091
hardcover, New
Miramar, FL, USA
$129.33
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108. McM C/Mixed Technologies and Thick Film Sensors
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1995, Springer
ISBN-13: 9780792334606
New Delhi, DELHI, INDIA
$156.16
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109. McM C/Mixed Technologies and Thick Film Sensors
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1995, Springer
ISBN-13: 9780792334606
Irving, TX, USA
$172.78
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110. MCM C/Mixed Technologies and Thick Film Sensors
by Jones, W K (Editor), and Kurzweil, Karel (Editor), and Harsányi, Gábor (Editor)
Seller Description: New. Print on demand Sewn binding. Cloth over boards. 318 p. Contains: Unspecified. NATO Science Partnership Subseries: 3, 2. See More Details
1995, Springer
ISBN-13: 9780792334606
Hardcover, New
NV, USA
$215.66
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111. Multichip Module Design, Fabrication, and Testing (Electronic Packaging and Interconnection)
by James J. Licari
Seller Description: Fine. Pages are clean and are not marred by notes or folds of any kind. ~ ThriftBooks: Read More, Spend Less. See More Details
1994, McGraw-Hill
ISBN-13: 9780070377158
Hardcover, Fine/Like New
Reno, NV, USA
$17.99
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112. Multichip Module Design, Fabrication, and Testing (Electronic Packaging and Interconnection)
by Licari, James J.
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1994, McGraw-Hill
ISBN-13: 9780070377158
hardcover, Good
Santa Clarita, CA, USA
$47.61
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113. Electronics Packaging Forum: Multichip Module Technology Issues
Seller Description: Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book. See More Details
1994, IEEE
ISBN-13: 9780780304390
hardcover, Good
Santa Clarita, CA, USA
$48.26
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114. Physical Design for Multichip Modules
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1994, Springer
ISBN-13: 9780792394501
New Delhi, DELHI, INDIA
$118.54
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115. Physical Design for Multichip Modules
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1994, Springer
ISBN-13: 9780792394501
New Delhi, DELHI, INDIA
$125.57
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116. Physical Design for Multichip Modules
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1994, Springer
ISBN-13: 9780792394501
Irving, TX, USA
$137.52
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117. Physical Design for Multichip Modules
by Sriram, Mysore, and Sung-Mo (Steve) Kang
Seller Description: Fine. Sewn binding. Cloth over boards. 197 p. Contains: Unspecified. The Springer International Engineering and Computer Science, 267. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
1994, Springer
ISBN-13: 9780792394501
Hardcover, Fine/Like New
Castle Donington, DERBYSHIRE, UNITED KINGDOM
$165.56
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118. Physical Design for Multichip Modules
by Sriram, Mysore, and Sung-Mo (Steve) Kang
Seller Description: New. Sewn binding. Cloth over boards. 197 p. Contains: Unspecified. The Springer International Engineering and Computer Science, 267. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
1994, Springer
ISBN-13: 9780792394501
Hardcover, New
Castle Donington, DERBYSHIRE, UNITED KINGDOM
$165.89
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119. Physical Design for Multichip Modules
by Sriram, Mysore, and Sung-Mo (Steve) Kang
Seller Description: New. Print on demand Sewn binding. Cloth over boards. 197 p. Contains: Unspecified. The Springer International Engineering and Computer Science, 267. See More Details
1994, Springer
ISBN-13: 9780792394501
Hardcover, New
NV, USA
$168.69
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120. Physical Design for Multichip Modules
by Sriram, Mysore, and Sung-Mo (Steve) Kang
Seller Description: Fine. Sewn binding. Cloth over boards. 197 p. Contains: Unspecified. The Springer International Engineering and Computer Science, 267. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
1994, Springer
ISBN-13: 9780792394501
Hardcover, Fine/Like New
Columbia, MD, USA
$176.35
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121. Physical Design for Multichip Modules
by Sriram, Mysore, and Sung-Mo (Steve) Kang
Seller Description: New. Sewn binding. Cloth over boards. 197 p. Contains: Unspecified. The Springer International Engineering and Computer Science, 267. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
1994, Springer
ISBN-13: 9780792394501
Hardcover, New
Columbia, MD, USA
$176.60
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