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151. McM C/Mixed Technologies and Thick Film Sensors
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1995, Springer
ISBN-13: 9780792334606
New Delhi, DELHI, INDIA
$151.67
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152. McM C/Mixed Technologies and Thick Film Sensors
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1995, Springer
ISBN-13: 9780792334606
Irving, TX, USA
$168.20
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153. MCM C/Mixed Technologies and Thick Film Sensors
by Jones, W K (Editor), and Kurzweil, Karel (Editor), and Harsányi, Gábor (Editor)
Seller Description: New. Print on demand Sewn binding. Cloth over boards. 318 p. Contains: Unspecified. NATO Science Partnership Subseries: 3, 2. See More Details
1995, Springer
ISBN-13: 9780792334606
Hardcover, New
NV, USA
$215.66
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154. MCM C/Mixed Technologies and Thick Film Sensors
by Jones, W K (Editor), and Kurzweil, Karel (Editor), and Harsányi, Gábor (Editor)
Seller Description: New. Sewn binding. Cloth over boards. 318 p. Contains: Unspecified. NATO Science Partnership Subseries: 3, 2. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
1995, Springer
ISBN-13: 9780792334606
Hardcover, New
Castle Donington, DERBYSHIRE, UNITED KINGDOM
$230.68
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155. MCM C/Mixed Technologies and Thick Film Sensors
by Jones, W K (Editor), and Kurzweil, Karel (Editor), and Harsányi, Gábor (Editor)
Seller Description: Fine. Sewn binding. Cloth over boards. 318 p. Contains: Unspecified. NATO Science Partnership Subseries: 3, 2. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
1995, Springer
ISBN-13: 9780792334606
Hardcover, Fine/Like New
Castle Donington, DERBYSHIRE, UNITED KINGDOM
$230.68
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156. Multichip Module Design, Fabrication, and Testing (Electronic Packaging and Interconnection)
by James J. Licari
Seller Description: Fine. Pages are clean and are not marred by notes or folds of any kind. ~ ThriftBooks: Read More, Spend Less. See More Details
1994, McGraw-Hill
ISBN-13: 9780070377158
Hardcover, Fine/Like New
Reno, NV, USA
$17.98
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157. Multichip Module Design, Fabrication, and Testing (Electronic Packaging and Interconnection)
by Licari, James J.
Seller Description: Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book. See More Details
1994, McGraw-Hill
ISBN-13: 9780070377158
hardcover, Good
Santa Clarita, CA, USA
$47.61
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158. Electronics Packaging Forum: Multichip Module Technology Issues
Seller Description: Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book. See More Details
1994, IEEE
ISBN-13: 9780780304390
hardcover, Good
Santa Clarita, CA, USA
$90.71
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159. Physical Design for Multichip Modules
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1994, Springer
ISBN-13: 9780792394501
New Delhi, DELHI, INDIA
$115.15
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160. Physical Design for Multichip Modules
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1994, Springer
ISBN-13: 9780792394501
New Delhi, DELHI, INDIA
$125.57
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161. Physical Design for Multichip Modules
by Sriram, Mysore, and Sung-Mo (Steve) Kang
Seller Description: New. Sewn binding. Cloth over boards. 197 p. Contains: Unspecified. The Springer International Engineering and Computer Science, 267. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
1994, Springer
ISBN-13: 9780792394501
Hardcover, New
Castle Donington, DERBYSHIRE, UNITED KINGDOM
$168.48
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162. Physical Design for Multichip Modules
by Sriram, Mysore, and Sung-Mo (Steve) Kang
Seller Description: Fine. Sewn binding. Cloth over boards. 197 p. Contains: Unspecified. The Springer International Engineering and Computer Science, 267. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
1994, Springer
ISBN-13: 9780792394501
Hardcover, Fine/Like New
Columbia, MD, USA
$178.36
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163. Physical Design for Multichip Modules
by Sriram, Mysore, and Sung-Mo (Steve) Kang
Seller Description: New. Sewn binding. Cloth over boards. 197 p. Contains: Unspecified. The Springer International Engineering and Computer Science, 267. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
1994, Springer
ISBN-13: 9780792394501
Hardcover, New
Columbia, MD, USA
$178.61
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164. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: a Focus on Reliability
by Pecht, Michael
Seller Description: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority! See More Details
1994, Wiley-Interscience
ISBN-13: 9780471594468
Hardcover, Good
Dallas, TX, USA
$180.63
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165. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
by Pecht, Michael G
Seller Description: Fine. Sewn binding. Cloth over boards. 464 p. Contains: Unspecified. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
1994, Wiley-Interscience
ISBN-13: 9780471594468
Hardcover, Fine/Like New
Columbia, MD, USA
$181.74
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166. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
by Pecht, Michael G
Seller Description: New. Sewn binding. Cloth over boards. 464 p. Contains: Unspecified. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
1994, Wiley-Interscience
ISBN-13: 9780471594468
Hardcover, New
Columbia, MD, USA
$189.89
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167. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
by Pecht, Michael G
Seller Description: New. Sewn binding. Cloth over boards. 464 p. Contains: Unspecified. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
1994, Wiley-Interscience
ISBN-13: 9780471594468
Hardcover, New
Castle Donington, DERBYSHIRE, UNITED KINGDOM
$190.37
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168. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
by Michael G. Pecht
Seller Description: PLEASE NOTE, WE DO NOT SHIP TO DENMARK. New Book. Shipped from UK in 4 to 14 days. Established seller since 2000. Please note we cannot offer an expedited shipping service from the UK. See More Details
1994, Wiley
ISBN-13: 9780471594468
Hardcover, New
Fairford, GLOUCESTERSHIRE, UNITED KINGDOM
$190.38
