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176. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
by Michael G. Pecht
Seller Description: PLEASE NOTE, WE DO NOT SHIP TO DENMARK. New Book. Shipped from UK in 4 to 14 days. Established seller since 2000. Please note we cannot offer an expedited shipping service from the UK. See More Details
1994, Wiley
ISBN-13: 9780471594468
Hardcover, New
Fairford, GLOUCESTERSHIRE, UNITED KINGDOM
$190.38
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177. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
by Pecht, Michael
Seller Description: New. Print on demand Sewn binding. Cloth over boards. 464 p. Contains: Unspecified. See More Details
1994, Wiley-Interscience
ISBN-13: 9780471594468
Hardcover, New
NV, USA
$191.90
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178. Physical Design for Multichip Modules
by Sriram, Mysore, and Sung-Mo (Steve) Kang
Seller Description: New. Sewn binding. Cloth over boards. 197 p. Contains: Unspecified. The Springer International Engineering and Computer Science, 267. See More Details
1994, Springer
ISBN-13: 9780792394501
Hardcover, New
Uxbridge, MIDDLESEX, UNITED KINGDOM
$192.20
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179. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
by Pecht, Michael G
Seller Description: Fine. Sewn binding. Cloth over boards. 464 p. Contains: Unspecified. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers. See More Details
1994, Wiley-Interscience
ISBN-13: 9780471594468
Hardcover, Fine/Like New
Castle Donington, DERBYSHIRE, UNITED KINGDOM
$192.74
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180. Physical Design for Multichip Modules (the Springer International Series in Engineering and Computer Science, 267)
by Sriram, Mysore
Seller Description: New. See More Details
1994, Springer
ISBN-13: 9780792394501
hardcover, New
Miramar, FL, USA
$193.91
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181. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
by Pecht, Michael G
Seller Description: New. Sewn binding. Cloth over boards. 464 p. Contains: Unspecified. See More Details
1994, Wiley-Interscience
ISBN-13: 9780471594468
Hardcover, New
Uxbridge, MIDDLESEX, UNITED KINGDOM
$213.20
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182. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
by Pecht, Michael G
Seller Description: New. Sewn binding. Cloth over boards. 464 p. Contains: Unspecified. See More Details
1994, Wiley-Interscience
ISBN-13: 9780471594468
Hardcover, New
Southport, MERSEYSIDE, UNITED KINGDOM
$238.88
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183. Conceptual Design of Multichip Modules and Systems
by Sandborn, Peter A.; Moreno, Hector
Seller Description: Good. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less. See More Details
1993, Springer
ISBN-13: 9780792393955
Hardcover, Good
Reno, NV, USA
$46.97
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184. Electronics Packaging Forum: Multichip Module Technology Issues
by Rubel, Lee A.
Seller Description: Very good. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less. See More Details
1993, IEEE
ISBN-13: 9780780304390
Hardcover, Very Good
Reno, NV, USA
$58.00
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185. Microelectronic System Interconnections-Performance and Modeling/Pc0300-4
Seller Description: Brand New. New. See More Details
1993, Institute of Electrical & Electronics Engineers(IEEE)
ISBN-13: 9780780304055
New Delhi, DELHI, INDIA
$63.62
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186. Microelectronic System Interconnections-Performance and Modeling/Pc0300-4
Seller Description: Brand New. New. See More Details
1993, Institute of Electrical & Electronics Engineers(IEEE)
ISBN-13: 9780780304055
New Delhi, DELHI, INDIA
$63.74
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187. Electronics Packaging Forum-Multichip Module Technology Issues
Seller Description: Brand New. New. See More Details
1993, Institute of Electrical & Electronics Engineers(IEEE)
ISBN-13: 9780780304390
New Delhi, DELHI, INDIA
$68.15
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188. Electronics Packaging Forum-Multichip Module Technology Issues
Seller Description: Brand New. New. See More Details
1993, Institute of Electrical & Electronics Engineers(IEEE)
ISBN-13: 9780780304390
New Delhi, DELHI, INDIA
$68.28
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189. Electronics Packaging Forum-Multichip Module Technology Issues
Seller Description: New, US edition. Satisfaction guaranteed! ! See More Details
1993, Institute of Electrical & Electronics Engineers(IEEE)
ISBN-13: 9780780304390
Irving, TX, USA
$76.42
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190. Electronics Packaging Forum-Multichip Module Technology Issues
Seller Description: Brand New. New Book Original US edition, We Ship to PO BOX Address also. See More Details
1993, Institute of Electrical & Electronics Engineers(IEEE)
ISBN-13: 9780780304390
Sterling Heights, MI, USA
$77.04
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191. Electronics Packaging Forum-Multichip Module Technology Issues
Seller Description: New, Satisfaction guaranteed! ! See More Details
1993, Institute of Electrical & Electronics Engineers(IEEE)
ISBN-13: 9780780304390
Irving, TX, USA
$77.42
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192. Microelectronic System Interconnections-Performance and Modeling/Pc0300-4
Seller Description: New, Satisfaction guaranteed! ! See More Details
1993, Institute of Electrical & Electronics Engineers(IEEE)
ISBN-13: 9780780304055
Irving, TX, USA
$77.42
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193. Conceptual Design of Multichip Modules and Systems (the Springer International Series in Engineering and Computer Science, 250)
by Sandborn, Peter A.
Seller Description: Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book. See More Details
1993, Springer
ISBN-13: 9780792393955
hardcover, Good
Santa Clarita, CA, USA
$87.91
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194. Conceptual Design of Multichip Modules and Systems
Seller Description: Brand New. New. See More Details
1993, Springer
ISBN-13: 9780792393955
New Delhi, DELHI, INDIA
$116.52
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195. Conceptual Design of Multichip Modules and Systems (the Springer International Series in Engineering and Computer Science, 250)
by Sandborn, Peter A.
Seller Description: New. See More Details
1993, Springer
ISBN-13: 9780792393955
hardcover, New
Miramar, FL, USA
$127.76
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