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376. Design and Applications of Emerging Computer Systems
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378. Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices
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379. Design and Applications of Emerging Computer Systems
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380. Thermal Management Materials for Electronic Packaging
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381. Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices
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382. Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices
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383. Design and Applications of Emerging Computer Systems
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390. Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices
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391. Modeling of Algan/Gan High Electron Mobility Trans
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393. Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices
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