Package Electrical Modeling, Thermal Modeling, and Processing for Gaas Wireless Applications

Packaging engineers now have to work with die level designers to either create a package that performs well at high frequencies or to use readily available low cost packages that happen to meet the needs of the application. Read More

Packaging engineers now have to work with die level designers to either create a package that performs well at high frequencies or to use readily available low cost packages that happen to meet the needs of the application. Read Less