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Ken Gilleo
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Mems: Fundamental Technology...
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RF and Microwave...
Ken Kuang (Editor),
Franklin Kim (Editor)
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Polymer Thick Film: Today's...
Ken Gilleo
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Electronic Packaging,...
Charles A Harper, President,
Martin B Miller (Editor)
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Lcp for Microwave Packages...
Anh-Vu H. Pham,
Morgan J. Chen
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Plastic-Encapsulated...
Michael Pecht (Editor),
Luu T Nguyen (Editor)
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Electronic Packaging and...
Morris E Nicholson
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Foldable Flex and Thinned...
John W. Balde (Editor)
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Microelectronic Packaging
Madhav Datta,
Tetsuya Osaka (Editor)
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System on Package:...
Rao Tummala
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Microelectronic...
G G Harman (Editor),
Pavel Mach (Editor)
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Antenna-In-Package Technology...
Duixian Liu,
Yueping Zhang
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Flip Chip Technologies
John H Lau
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Introduction to Microsystem...
Yufeng Jin,
Zhiping Wang
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Adhesion in Microelectronics
K L Mittal,
Tanweer Ahsan
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Directions for the Next...
Nirod K Das (Editor),
Henry L Bertoni (Editor)
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Microelectronics Packaging...
R R Tummala,
Eugene J Rymaszewski
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Advanced MEMS Packaging
John H Lau,
Cheng Kuo Lee
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Surface Mounted Assemblies
J F Pawling
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Multichip Modules: Systems...
R Wayne Johnson,
Robert Teng (Editor)
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Handbook of Microelectronics...
N Sinnadural
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Microelectronic System...
Stuart K Tewksbury,
Stuart K Tewskbury (Editor)
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