Thermal Management Handbook:...
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System-In-Package RF Design...
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Low Cost Flip Chip...
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Multichip Module Technology...
Philip E Garrou,
Imaps
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SiP System-in-Package Design...
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Hybrid Assemblies and...
Fred W Kear
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System on Package:...
Rao Tummala
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Conceptual Design of...
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Hector Moreno
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Physical Design for Multichip...
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Flip Chip Technologies
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Multi-Chip Module Test...
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Area Array Packaging Processes
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Electronics Packaging Forum:...
James E Morris (Editor),
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MCM C/Mixed Technologies and...
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Integrated Circuit, Hybrid,...
Michael G Pecht
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Multichip Modules: Systems...
R Wayne Johnson,
Robert Teng (Editor)
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Microelectronic System...
Stuart K Tewksbury,
Stuart K Tewskbury (Editor)
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