SiP System-in-Package Design...
Suny Li (Li Yang)
Buy from $124.50
|
MCM C/Mixed Technologies and...
W K Jones (Editor),
Karel Kurzweil (Editor)
Buy from $215.66
|
Multi-Chip Module Test...
Yervant Zorian (Editor)
Buy from $107.04
|
Physical Design for Multichip...
Mysore Sriram,
Sung-Mo (Steve) Kang
Buy from $138.46
|
Multichip Modules with...
W K Jones (Editor),
Gábor Harsányi (Editor)
Buy from $112.32
|
Conceptual Design of...
Peter A. Sandborn,
Hector Moreno
Buy from $150.95
|
System on Package:...
Rao Tummala
Buy from $94.90
|
System-In-Package RF Design...
Michael P Gaynor
Buy from $77.79
eBook from $82.00
|
Area Array Packaging Processes
Ken Gilleo
Buy from $104.94
|
Area Array Packaging Processes
Ken Gilleo
Buy from $142.77
|
Low Cost Flip Chip...
John H Lau,
C P Wong (Foreword by)
Buy from $56.96
|
Advanced Electronic Packaging...
William D Brown (Editor)
Buy from $29.19
|
Thermal Management Handbook:...
Jerry E Sergent,
Al Krum
Buy from $58.64
|
Multichip Module Technology...
Philip E Garrou,
Imaps
Buy from $70.34
|
Multi-Chip Module Test...
Yervant Zorian (Editor)
Buy from $112.32
|
Flip Chip Technologies
John H Lau
Buy from $46.93
|
MCM C/Mixed Technologies and...
W K Jones (Editor),
Karel Kurzweil (Editor)
Buy from $114.79
|
Routing in the Third...
Naveed A Sherwani,
Siddharth Bhingarde
Buy from $80.37
|
Physical Design for Multichip...
Mysore Sriram,
Sung-Mo (Steve) Kang
Buy from $138.46
|
Integrated Circuit, Hybrid,...
Michael G Pecht
Buy from $182.13
|
Multichip Module Design Fabr...
James J Licari,
Licari
Buy from $18.00
|
Electronics Packaging Forum:...
James E Morris (Editor),
Thomas J Watson (Editor)
Buy from $18.00
|
Sensing Modeling and...
Asme Conference Proceedings
Buy from $72.95
|
