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Microelectronic Packaging
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Tetsuya Osaka (Editor)
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Physical Design for Multichip...
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Flip Chip Technologies
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Adhesion in Microelectronics
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Tanweer Ahsan
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Electronic Packaging of High...
Stephen G Konsowski,
Arden R Helland
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Michael Pecht,
Rakish Agarwal
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Microelectronics Packaging...
R R Tummala,
Eugene J Rymaszewski
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Advanced MEMS Packaging
John H Lau,
Cheng Kuo Lee
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William D Brown (Editor)
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IC Component Sockets
Weifeng Liu,
Michael G Pecht
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Surface Mounted Assemblies
J F Pawling
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R Wayne Johnson,
Robert Teng (Editor)
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Handbook of Microelectronics...
N Sinnadural
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Microelectronic System...
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Stuart K Tewskbury (Editor)
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