Semiconductor Advanced...
John H. Lau
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Physical Design Essentials:...
Khosrow Golshan
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Adhesives Technology for...
James J Licari,
Dale W Swanson
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Hermeticity of electronic...
Hal Greenhouse
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Lead-Free Soldering
Jasbir Bath (Editor)
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Handbook of Lead-Free Solder...
Karl J Puttlitz,
Kathleen A Stalter
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Electrical Conductive...
Li,
Daniel Lu
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Practical Guide to the...
Ali Jamnia
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Integrated Circuit Packaging,...
William Greig
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Modeling, Analysis, Design,...
Hengyun Zhang,
Faxing Che
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Embedded and Fan-Out Wafer...
Beth Keser (Editor),
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Mems and Microsystems: Design...
Tai-Ran Hsu
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Mems Packaging
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Yu-ting Cheng (Editor)
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Mechanical Analysis of...
Stephen A. McKeown
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Air cooling technology for...
Sung Jin Kim (Editor),
Sang Woo Lee (Editor)
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The Electronic Packaging...
Glenn R Blackwell (Editor)
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Mems: Fundamental Technology...
Vikas Choudhary (Editor),
Krzysztof Iniewski (Editor)
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RF and Microwave...
Ken Kuang (Editor),
Franklin Kim (Editor)
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Lcp for Microwave Packages...
Anh-Vu H. Pham,
Morgan J. Chen
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Advanced Materials for...
Xingcun Colin Tong
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Foldable Flex and Thinned...
John W. Balde (Editor)
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Antenna-In-Package Technology...
Duixian Liu,
Yueping Zhang
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Introduction to Microsystem...
Yufeng Jin,
Zhiping Wang
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Adhesion in Microelectronics
K L Mittal,
Tanweer Ahsan
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